-ar Módulos multiprotocolo

Resultados: 197
Seleccionar Imagen N.° de pieza Fabricante: Descripción Hoja de datos Disponibilidad Precio: (USD) Filtre los resultados en la tabla por precio unitario en función de su cantidad. Cantidad RoHS Modelo ECAD Serie Frecuencia Potencia de salida Tipo de interfaz Voltaje de alimentación - Mín. Voltaje de alimentación - Máx. Temperatura de trabajo mínima Temperatura de trabajo máxima Conector de tipo antena Dimensiones Protocolo: Bluetooth, BLE - 802.15.1 Protocolo: Celular, NBIoT, LTE Protocolo: GPS, GLONASS Protocolo: Sub-GHz Protocolo: WiFi - 802.11 Protocolo: ANT, Thread, Zigbee - 802.15.4 Empaquetado
Quectel Módulos multiprotocolo Embedded, 1559-1606, GNSS L1, Ceramic, -, -, Pin Mounting, 25 25 4 2En existencias
Min.: 1
Mult.: 1

21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1 BDS, Galileo, GLONASS, GPS
Quectel Módulos multiprotocolo Embedded, 1710-2700, 3300-5000, 5G, FPC with holder, -, Spring contact, Screw, 37.25 9.6 10.1 1En existencias
Min.: 1
Mult.: 1

21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS
Espressif Systems Módulos multiprotocolo "ESP32-C5-WROOM-1 and ESP32-C5-WROOM-1U are two general-purpose 2.4 and 5 GHz dual-band Wi-Fi 6 (802.11ax), Bluetooth 5 (LE), Zigbee, and Thread (802.15.4) modules. The rich set of peripherals and high performance make the module an ideal choice for
Min.: 1
Mult.: 1

240 MHz 20 dBm I2C, SPI, UART 3 V 3.6 V - 40 C + 85 C 27.5 mm x 18 mm x 3.3 mm
Quectel Módulos multiprotocolo Cat M1/Cat NB2, Power Class 5, 450 MHz Supported + GNSS (w/o WWAN concurrency) 34En existencias
Min.: 1
Mult.: 1
Carrete: 250

26 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS Reel, Cut Tape
Texas Instruments Módulos multiprotocolo SimpleLink multipro tocol 2.4-GHz wirele
Min.: 1
Mult.: 1
Carrete: 2,000

CC2651R3SIPA 2.4 GHz 5 dBm I2C, I2S, SPI, SSI, UART 1.8 V 3.8 V - 40 C + 105 C External, Integrated 7 mm x 7 mm BLE Thread, Zigbee Reel, Cut Tape, MouseReel
CEL Módulos multiprotocolo ZB/Thread/BT, +20dBm, 1.64Mb, Antenna BULK 3En existencias
Min.: 1
Mult.: 1

2.4 GHz 20 dBm ADC, GPIO, I2C, QSPI, SPI, UART, USB 3.3 V 3.3 V - 40 C + 85 C PCB 16.7 mm x 26.3 mm Bluetooth 5.0 Thread, Zigbee Bulk
Silicon Labs Módulos multiprotocolo Wireless gecko multi-protocol module, +20 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, built-in antenna, certified.
400En pedido
Min.: 1
Mult.: 1

MGM210P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Ezurio Módulos multiprotocolo Module, Veda IF912, SIP, Dual Band, No Memory, RF Trace Pin, Cut Tape (Infineon ARM Cortex 33 Airoc CYW55912)
Min.: 1
Mult.: 1

IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Ezurio Módulos multiprotocolo Module, Veda IF913, SIP, Tri Band, No Memory, RF Trace Pin, (Infineon ARM Cortex 33 Airoc CYW55913)
Min.: 1
Mult.: 1
IF913 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Ezurio Módulos multiprotocolo Wi-Fi Module, Veda IF912, SIP, Dual Band, 8M PSRAM, 8M Flash, RF Trace Pin, (Infineon ARM Cortex 33 Airoc CYW55912)
Min.: 1
Mult.: 1

IF912 32.768 kHz 3.13 V 4.8 V - 40 C + 85 C 11 mm x 7 mm x 1.4 mm Bluetooth LE WiFi 6, 802.11 a/b/g/n/ax/ac Cut Tape
Silicon Labs Módulos multiprotocolo MGM210P Wireless Gecko Multiprotocol Module, PCB, Secure Vault, +20 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin
Min.: 1
Mult.: 1

2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Microchip Technology Módulos multiprotocolo Bluetooth Low Energy/Zigbee Combo Module with PCB Antenna and extended temperature
Min.: 1
Mult.: 1

2.4 GHz 12 dBm 1.9 V 3.6 V - 40 C + 125 C 7 mm x 7 mm x 0.9 mm Bluetooth Zigbee Tray
Murata Electronics Módulos multiprotocolo Type 2FR module
Min.: 1
Mult.: 1
Carrete: 1,000

2FR 2.484 GHz 18 dBm SPI 3.14 V 3.46 V - 40 C + 85 C 12 mm x 11 mm x 1.5 mm Reel, Cut Tape
Quectel Módulos multiprotocolo Cat M1/Cat NB2/EGPRS + GNSS (w/o WWAN concurrency), no VoLTE
Min.: 1
Mult.: 1
Carrete: 250

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 21 dBm ADC, GPIO, I2C, PCM, UART, USB 2.0 3.3 V 4.3 V - 35 C + 75 C Built-In 18.7 mm x 16 mm x 2.1 mm EGPRS, LTE Cat-M1, LTE Cat NB2 GNSS Reel, Cut Tape
Quectel Módulos multiprotocolo Cat M1/Cat NB2/EGPRS, Power Class 5 (21dBm) + GNSS (w/o WWAN concurrency), Data ONLY! 116En existencias
Min.: 1
Mult.: 1
Carrete: 250

850 MHz, 900 MHz, 1.8 GHz, 1.9 GHz 21 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm EGPRS, LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS Reel, Cut Tape
Quectel Módulos multiprotocolo Cat M1/Cat NB2 - Standard version + GNSS (w/o WWAN concurrency)
Min.: 1
Mult.: 1
Carrete: 500

21 dBm ADC, GPIO, I2C, PCM, USB 2.0, UART 2.6 V 4.8 V - 35 C + 75 C RP-SMA 14.9 mm x 12.9 mm x 1.7 mm LTE Cat-M1/NB2 GLONASS, GPS Reel, Cut Tape, MouseReel
Quectel Módulos multiprotocolo Cat M1/Cat NB2, Power Class 3 (23 dBm) + GNSS (w/o WWAN concurrency) Plazo de entrega 14 Semanas
Min.: 1
Mult.: 1
Carrete: 250

23 dBm GPIO, I2C, UART, USB 2.6 V 4.8 V - 35 C + 75 C Integrated 23.6 mm x 19.9 mm x 2.2 mm LTE Cat M1/NB2 BDS, Galileo, GLONASS, GPS Reel, Cut Tape
Quectel Módulos multiprotocolo cloud enabled, Wi-Fi 4, 2.4GHz, BLE 5.2, Antenna: PCB, 2MB flash No en existencias
Min.: 1
Mult.: 1
Carrete: 250
2.4 GHz UART 3 V 3.6 V - 40 C + 85 C PCB 20 mm x 18 mm x 2.6 mm BLE 5.2 802.11 b/g/n Reel, Cut Tape
Silicon Labs Módulos multiprotocolo 802.15.4 Module, SiP, Secure Boot with Root of Trust and Secure Loader (RTSL), +6.5 dBm, 2.4 GHz, 768kB flash, 64kB RAM, -40 to +105 C, 26 GPIO, Certified Plazo de entrega no en existencias 12 Semanas
Min.: 2,500
Mult.: 2,500
Carrete: 2,500

MGM270S 76.8 MHz - 40 C + 105 C 6.5 mm x 6.5 mm x 1.3 mm Bluetooth Reel

Embedded Artists Módulos multiprotocolo 1LV M.2 Wi-Fi 4 a/b/g/n/ac, Bluetooth 5.0 with CYW43012 chipset and LBEE59B1LV
Plazo de entrega no en existencias 10 Semanas
Min.: 1,000
Mult.: 1

EA M.2 Modules 2.4 GHz, 5 GHz 4-Wire UART, SDIO 3 V 3.6 V - 20 C + 70 C Integrated 22 mm x 44 mm Bluetooth 5.2 802.11 a/b/g/n/ac Bulk
Silicon Labs Módulos multiprotocolo Mighty Gecko ARM Cortex-M4 1024 kB flash, 256 kB RAM module Plazo de entrega no en existencias 12 Semanas
Min.: 1,000
Mult.: 1,000
Carrete: 1,000

2.4 GHz 10 dBm I2C, SPI, UART 1.8 V 3.8 V - 40 C + 85 C Chip 17.8 mm x 12.9 mm x 2.3 mm Bluetooth Thread, Zigbee Reel
Embedded Artists Módulos multiprotocolo 1XA M.2 Wi-Fi 5 a/b/g/n/ac MIMO, Bluetooth 5.2 with CYW54591 and LBEE5XV1XA Plazo de entrega no en existencias 3 Semanas
Min.: 1
Mult.: 1

2.4 GHz, 5 GHz 4-Wire UART, SDIO 3 V 3.6 V - 30 C + 85 C u.FL Bluetooth 5.1 802.11 a/b/g/n/ac Bulk
Silicon Labs Módulos multiprotocolo Mighty Gecko ARM Cortex-M4 1024 kB flash, 256 kB RAM module Plazo de entrega no en existencias 12 Semanas
Min.: 1
Mult.: 1

2.4 GHz I2C, SPI, UART 3.3 V 3.3 V - 40 C + 85 C 17.8 mm x 12.9 mm x 2.3 mm Cut Tape
Silicon Labs Módulos multiprotocolo MGM210P Wireless Gecko Multiprotocol Module, PCB, Secure Vault, +20 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin Plazo de entrega no en existencias 12 Semanas
Min.: 1
Mult.: 1
Carrete: 1,000

2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Telink Módulos multiprotocolo Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this Plazo de entrega no en existencias 6 Semanas
Min.: 1
Mult.: 1

ML7 2.4 GHz to 2.483 GHz 8.5 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 85 C 35.29 mm x 18 mm x 2.6 mm Reel