Parece que JavaScript está deshabilitado en su navegador. Si no inicia sesión, algunas funciones en esta página no funcionarán.

¿Vé algún error?

HDF-V15-113L051

Name: NorComp HDF-V15-113L051
Brand: NorComp
SKU: 636-HDF-V15-113L051
Price: 15.43 USD
Availability: InStock

Las imágenes son para referencia solamente
Ver especificaciones del producto

Mouser N.º:

636-HDF-V15-113L051

Fabricante N.º:

HDF-V15-113L051

Fabricante:

NorComp

Descripción:

Conectores de alta densidad subminiatura D 15 pin vert solder M FL 4-40 thrd brdlck

Hoja de datos:

HDF-V15-113L051 Hoja de datos (PDF)

Modelo ECAD:

Descargue Library Loader gratis para convertir este archivo para su herramienta ECAD. Conozca más sobre el modelo ECAD.

Más información

Conozca más sobre NorComp HDF-V15-113L051

En existencias: 7

Existencias:: 7 Se puede enviar inmediatamente

Se ha producido un error inesperado. Vuelva a intentarlo más tarde.

Introducir cantidad:

Mínimo: 1 Múltiples: 1

Precio unitario:

$-.--

Precio ext.:

$-.--

Est. Tarifa:

Precio (USD)

Cantidad	Precio unitario	Precio ext.
	$15.43	$15.43
	$13.12	$131.20
	$12.30	$307.50
	$11.52	$576.00
	$10.96	$1,096.00
	$10.44	$2,630.88
	$9.95	$5,014.80
	$9.46	$9,535.68

.hidden-for-nojs { display: none; } .pull-right-nojs { justify-content: flex-end; }

Atributo del producto	Valor de atributo	Seleccionar atributo
Fabricante:	NorComp
Categoría de producto:	Conectores de alta densidad subminiatura D
RoHS:
REACH - SVHC:
Número de posiciones:	15 Position
Número de filas:	3 Row
Género:	Male
Estilo de terminación:	Solder Tail
Ángulo de montaje:	Straight
Revestimiento del contacto:	Gold
Régimen de corriente:	3 A
Serie:	HDF
Clasificación IP:	IP67
Empaquetado:	Tray
Marca:	NorComp
Material del contacto:	Brass
País de ensamblaje:	Not Available
País de difusión:	Not Available
País de origen:	TW
Filtrado:	Unfiltered
Aislamiento:	Insulated
Material de aislamiento:	Polybutylene Terephthalate (PBT)
Temperatura de trabajo máxima:	+ 85 C
Temperatura de trabajo mínima:	- 25 C
Estilo de montaje:	Panel
Tipo de producto:	High Density D-Sub Connectors
Material de la cubierta:	Steel
Revestimiento de la carcasa:	Tin
Cantidad de empaque de fábrica:	63
Subcategoría:	D-Sub Connectors
Nombre comercial:	NANOOK

Productos encontrados:

Para mostrar productos similares, seleccione al menos una casilla de verificación

Seleccione al menos una de las casillas de verificación anteriores para mostrar productos similares en esta categoría.

Atributos seleccionados: 0

Filtrar documento:

MXHTS:: 8536699999
CAHTS:: 8536690020
USHTS:: 8536694040
JPHTS:: 853669000
KRHTS:: 8536691000
TARIC:: 8536693000
BRHTS:: 85366990
ECCN:: EAR99

NANOOK IP67 HDF High-Density D-Sub Connectors

NorComp NANOOK HDF High-Density D-Sub Connectors are offered in 15 to 62 positions with a contact rating of 3A. These IP67, flanged, waterproof connectors provide an all-inclusive solution for a wide range of applications. The D-sub connectors are available in solder cup, vertical solder tail, and right-angle solder tail contact terminations. Typical applications for NorComp NANOOK HDF High-Density D-Sub Connectors include industrial control systems, telecommunication equipment, and computer technology.

Industrial Automation Solutions

NorComp Industrial Automation Solutions feature connectors designed for industrial robotic devices. These highly complex electromechanical machines may contain multiple computers and motors, dozens of sensors, hydraulic pumps, and connections to a network. There is also a growing need for reduced size, weight, and power consumption, along with increased connector throughput. NorComp has engineered connectors to meet the challenging demands of robotic systems used in industrial automation.

NANOOK IP67 D-Sub Connectors

NorComp NANOOK IP67 D-Sub Connectors provide an all-inclusive solution for a wide range of applications. The connectors are available in standard, high-density, and mixed-layout styles. These cost-effective connectors are reliable and easy to install. Typical applications for NorComp NANOOK IP67 D-Sub Connectors include telecommunication equipment, industrial control systems, and computer technology.

High Density D-Sub Connectors

NorComp High Density D-Sub Connectors are available in cable and board mount options. Cable mount options include crimp and solder cup and the board mount options include Dip Solder, Wire Wrap, High Profile, Right Angle, & Surface Mount (SMT). This comprehensive NorComp High Density Density D-Sub product offering is available in both stamped & formed and machined contact options.

D-Sub Solutions

NorComp D-Sub Solutions offer a broad range of higher reliability D-Sub connectors, backshells, and hoods. NorComp's D-Sub product line is designed for applications that require a rugged, robust I/O connector system with various styles and mounting options. All are used in multiple industries, including computer, industrial, medical, and military markets.

Telematic Connector Solutions

NorComp Telematic Connectors offer exceptional reliability and superior protection against moisture with an IP67 rating. These connectors are designed to withstand high-vibration environments, ensuring optimal performance. Suitable applications include emergency warning systems, GPS navigation, vehicle tracking, and fleet management devices. NorComp Telematic Connectors provide a secure and reliable connection that is essential for the precise reporting of telematics technology.

Rugged Environment Certified (REC) Connectors

NorComp Rugged Environment Certified (REC) Connectors are ruggedized harsh-environment connector solutions that have been proven to withstand the most challenging environments. Rugged Environment Certified (REC) is an external testing certification certifying quality and performance. These connectors encompass D-sub and circular connectors that are available in standard, high-density, or mixed layout types. These connectors are reliable, cost-effective, provide ease of installation, and are ideal for use in many outdoor harsh environments including oil rigs, weather stations, and ruggedized industrial applications.